Here comes main reasons for the failure:
1. Components foot/ legs defective: coating, pollution, oxidation, common surface;
2. Solder pad rejected: coating, pollution, oxidation and warping;
3. Poor quality of soldering parts: composition, excessive and oxidation;
Here soldering parts normally including: soldering wire, soldering rod, brazing and soldering alloy.
4. Soldering flux quality problem: low welding resistance, high corrosion and low SIR;
5. Poor control defect of processing parameters: design, control and equipment;
6. Other auxiliary material defects: adhesive, cleaning agent.
PCBA soldering failure has a great influence on circuit performance, therefore, how to improve the design process, structure parameters, welding process, solder joint reliability, improve the yield of PCBA processing during PCBA fabricating, be a constantly job for all PCB related workers.
Any other points or suggestions for the above?
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